Displaying items by tag: nxp

Friday, 19 November 2021 21:27

NXP S32K146 Evaluation Board

NXP S32K146 Evaluation Board
Published in NXP
NXP's UWB and Bluetooth® technologies work together to provide greater location accuracy for Samsung Galaxy SmartTag+
Published in UWB
• New IoT ICs deliver highly precise positioning capabilities and fine ranging for IoT applications such as smart locks and IoT sensors
• UWB IoT modules and development kits are available now through NXP’s partner network
• Introducing TrimensionTM under the new brand name NXP offers one of the broadest UWB portfolios available with tailored sensing solutions for vehicles, smartphones, and IoT devices
Published in IoT
SECURE ULTRA-WIDEBAND (UWB)POSITIONING AND RANGING OPTIMIZED FOR IoT USE CASES
Published in Technical Report
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Because delivering connected devices shouldn’t be complex. No matter what device you’re working on, or what market you’re in.Let’s simplify Intelligence with Wi-Fi and Bluetooth.
Published in technical articles
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Sunday, 13 September 2020 13:20

NXP Wi-Fi® + Bluetooth® chips

 NXP wireless solutions build upon decades of Wi-Fi and Bluetooth silicon, system and software design expertise. NXP is committed to drive large-scale deployment across multiple markets by a broad array of power- and cost-optimized Wi-Fi and Bluetooth chipsets, enabling products with today’s most advanced Wi-Fi capabilities.

Published in Bluetooth chips
Sunday, 13 September 2020 10:46

Marvell’s Wireless part number changes

NXP Completes Acquisition of Marvell’s Wi-Fi and Bluetooth Connectivity Assets on Dec 2019.As part of the transition from Marvell to NXP, NXP is changing the orderable part number for shipments by NXP after the close of the acquisition. 
Published in news and reports
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NXP Semiconductors N.V. (NASDAQ: NXPI) announced on May 15 this year the availability of new devices within its KW3x family of microcontrollers (MCUs). The new KW39/38/37 MCUs add Bluetooth 5.0 long-range capabilities and expanded Bluetooth advertising channels. These enhancements are made while offering seamless migration with hardware, software and tools compatibility with the previous generation of devices, KW34/35/36. The connectivity MCUs allow Bluetooth LE devices to communicate at distances of more than a mile and increase the amount of Bluetooth advertising channels and advertising data within the Bluetooth standard, the predominant IoT protocol. The new wireless MCU solutions allow developers to address emerging use cases within automotive and industrial digitization.

Published in Bluetooth chips
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The FRDM-KW41Z is a development kit enabled by the Kinetis® W series KW41Z/31Z/21Z (KW41Z) family built on Arm® Cortex®-M0+ processor with integrated 2.4 GHz transceiver supporting Bluetooth® Smart/Bluetooth®Low Energy (BLE) v4.2, Generic FSK, IEEE® 802.15.4 and Thread.

The FRDM-KW41Z kit contains two Freedom boards that can be used as a development board or a shield to connect to a host processor. The FRDM-KW41Z is form-factor compatible with the Arduino® Rev3 pin layout for more expansion options.

The FRDM-KW41Z highly-sensitive, optimized 2.4 GHz radio features a PCB F-antenna which can be bypassed to test via SMA connection, multiple power supply options, push/capacitive touch buttons, switches, LEDs and integrated sensors.

The FRDM-KW41Z platform is now supported by Arm® Mbed OS and Zephyr OS, both open source embedded operating systems for developing the Internet of Things.

BOARD FRDM KW41Z PRODUCT SOOT

Freedom Development Boards for Kinetis KW21Z, KW31Z and KW41Z MCUs. 2 boards 
Technical and Functional Specifications

 
Can be configured as Host or Shield for connection to Host Processor
Connectivity
SMA RF Connector
Sensors Onboard NXP FXOS8700CQ digital sensor, 3D Accelerometer (±2g/±4g/±8g) + 3D Magnetometer
Debug OpenSDA and JTAG debug
Support
  • Full KSDK support
  • Supported by Zephyr® OS
  • Supports all DC-DC configurations (Buck, Boost, Bypass)
 
  • PCB inverted F-type antenna
  • RF regulatory certified
  • Serial Flash for OTA firmware upgrades
  • Arm® Mbed enabled
 
 
 
Published in Development Board
Saturday, 12 September 2020 10:37

NXP Connects 2020 - October 20-22

October 20-21, 2020 | October 21-22 APAC
Join NXP for our virtual event, featuring the latest technology for automotive, connectivity and edge processing. Find out how you can make your applications more secure and sustainable with our experts. October 20-22 – sign up today.
 
Published in Exhibition report
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