BM64

微芯
0.00

概述

Compliance Class 1,Class 2;
Certified to the United States (FCC), Innovation,Science and Economic Development Canada (ISED), European Economic Area (CE), Korea (KCC), Taiwan (NCC), Japan (MIC), China
(SRRC), and Brazil (ANATEL) radio regulations
 
Supports Bluetooth 5.0 dual-mode
- BDR/EDR transport for audio, voice, andSPP data exchange
- BLE transport for proprietary transparentservice and Apple Notification Center Service(ANCS) data exchange
 
High-speed HCI-UART interface (supports up to921,600 bps)
 
Peripherals
• Built-in lithium-ion and lithium-polymer batterycharger (up to 350 mA)
• Integrated 1.8V and 3V configurable switchingregulator and Low-Dropout (LDO) regulator
• Built-in ADC for battery monitoring and voltagesense
• Built-in ADC for charger thermal protection
• Built-in Undervoltage Protection (UVP)
• An auxiliary input port for external audio input
• Two LED drivers
• Multiple I/O pins for control and status
 
DSP Audio Processing
• Supports 64 kbps A-Law, A-Law PCM format/Continuous Variable Slope Delta (CVSD) modulationfor SCO channel operation
• Supports 8/16 kHz noise suppression
• Supports 8/16 kHz echo cancellation
• Supports Modified Sub-Band Coding (MSBC)decoder for wide band speech
• Built-in High Definition Clean Audio (HCA) algorithmsfor both narrow band and wide bandspeech processing
• Packet loss concealment (PLC)
• Built-in audio effect algorithms to enhance audiostreaming
• Supports Serial Copy Management System(SCMS-T) content protection

特性

• Qualified for Bluetooth v5.0 specification
• Supports A2DP 1.3, AVRCP 1.6, HFP 1.6, HSP
1.2 and SPP 1.2
• Supports Bluetooth 5.0 dual-mode (BDR/EDR/
BLE) specifications
• Stand-alone module with on-board PCB antenna
and Bluetooth stack
• Supports high resolution up to 24-bit, 96 kHz
audio data format
• Supports Bluetooth Low Energy data rate up to
1Mbits/s
• Supports connection of two hosts with HFP/A2DP
profiles simultaneously
• Transparent UART mode for seamless serial data
over UART interface
• Supports virtual UART communication between
host MCU and smartphone applications by Bluetooth
SPP or BLE link
• Easy to configure with Windows® GUI or directly
by external MCU
• Supports firmware field upgrade
• Supports one microphone
• Compact surface mount module:
- BM62: 29 x 15 x 2.5 mm
- BM64: 32 x 15 x 2.5 mm
• Castellated surface mount pads for easy and
reliable host PCB mounting
• RoHS compliant
• Ideal for portable battery-operated devices
• Internal battery regulator circuitry

特性

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方框图

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应用说明

• Portable speaker • Multiple speakers • Headset

开发板

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内核

-

CPU时钟频率

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CPU构造

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CPU特性

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蓝牙版本

5

频率

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Flash (kB)

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缓存

-

SRAM (kB)

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EEPROM (kB)

__

调试

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升级方式

Manual

晶振

no

PLL时钟

no

可选晶振

no

RC时钟

no

外部时钟

no

时钟 [数量, 位]

no

实时时钟

no

看门狗计数器

no

GPIO

12

针脚

43

针距

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通道

__

ADC [数量, 位]

16-bit ADC with 92 dB SNR

真随机数发生机器

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模拟组件

no

低功耗组件

no

温度传感器

NFC标签

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SPI

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DAC [数量, 位]

20-bit DAC with 98 dB SNR

UART

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同步串行接口

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PWM [数量, 位]

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I2C

__

TWI

no

QDEC

-

PDM

USB

no

SPI

no

Quad SPI

-

I2S

no

调试界面

-

人机界面

-

可编程通道

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固定通道

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通道组

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电压 [最小~最大] (V)

3.2 V~ 4.2 V

Low-Dropout (LDO) regulator

VBUS

no

可调供电输出

1.8V and 3V configurable switching regulator

电源失效

no

加密加速计

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公钥硬件加速器

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加速器

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安全

128-bit AES

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电流

Class 1: +15 dBm;
Class 2: +2 dBm;

传感器控制器

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待机

__

兼容标准

__

接收器灵敏度

-90 dBm (2 Mbps EDR)

输出功率

__

射频规范

__

协议

__

蓝牙5性能

2 Mbps

蓝牙5.1支持

Yes

尺寸

32 x 15 x 2.5 mm

封装型式

Surface mount module

DSP RAM

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DSP时钟速度

64 kbps

DSP时钟速度

64 kbps

音频控制

Sub-band Coding (SBC) and optional Advanced Audio Coding (AAC) decoding

概要

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