Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is expanding its wireless portfolio of high-performance, reliable and secure offerings. The newly developed AIROC™ brand now includes the industry’s first 1x1 Wi-Fi 6/6E and Bluetooth 5.2 combo SoC for the IoT, enterprise and industrial applications, and its first 2x2 Wi-Fi 6/6E and Bluetooth 5.2 combo SoC for multimedia, consumer and automotive applications. The Wi-Fi 6/6E combo solutions operate in the 2.4 GHz, 5 GHz, and the new, greenfield 6 GHz spectrum to deliver robust performance and minimal latency. This makes them ideal for high-quality video and audio streaming applications like gaming consoles, AR/VR, smart speakers, media-streaming devices and automotive Infotainment. Applications that require an instant response – like security systems and industrial automation – will also benefit from Infineon’s new products.

2020年12月17日,中科蓝讯CEO刘助展先生和北京声加科技CEO邱锋海先生联合发布了“讯龙二代”蓝牙SoC芯片。“讯龙二代”芯片在功耗、射频、ANC、AI等领域,性能都有了极大的提升,特别的,该芯片集成了声加科技的ENC算法。
中芯国际的28nm、14nm、12nm、N+1等技术均已进入规模量产,7nm技术开发已经完成,今年4月可以进入风险量产。
  • The company’s Wi-Fi and Wi-Fi/Bluetooth combo solutions are pre-integrated across its i.MX RT MCU platform, allowing developers to create the optimal pairing of processing with connectivity
  • NXP combines its MCU and Wi-Fi/Bluetooth platform solutions within its MCUXpresso Software Development Kit (SDK) to simplify and accelerate IoT product development
  • Connectivity modules and MCU development kits are available now through NXP’s extensive distribution network
  • Company introduces new 2x2 Wi-Fi 6 Dual Band + Bluetooth / Bluetooth Low Energy (BLE) solution that brings 1.2 Gbps performance, low power, and greater range to IoT markets.
  • Family of products deliver new levels of connectivity and power the world’s first Wi-Fi 6 enabled gaming consoles